File:A computational and experimental study of flush heat sources in liquids (IA acomputationalnd1094530645).pdf

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A computational and experimental study of flush heat sources in liquids   (Wikidata search (Cirrus search) Wikidata query (SPARQL)  Create new Wikidata item based on this file)
Author
Haukenes, Larry Olaf
image of artwork listed in title parameter on this page
Title
A computational and experimental study of flush heat sources in liquids
Publisher
Monterey, California. Naval Postgraduate School
Description

A numerical investigation of two-dimensional natural convection flow and heat transfer from a substrate-mounted flush heat source immersed in a liquid-filled square enclosure was conducted. The study is relevant to direct liquid-immersion cooling of electronic-components. A control volume based finite-difference model that accounts for conduction heat transfer within the substrate and heat source and the coupled natural convection in the fluid was utilized. Numerical predictions were obtained for a wide range of Rayleigh and Prandtl numbers, substrate to fluid and heat source to fluid thermal conductivity ratios and other geometrical parameters that may be encountered in practice. An increase in Rayleigh number lead to more vigorous flow and promoted cooling. No noticeable effect on the nondimensional temperature was observed when changing the Prandt number from 7 to 100. Little reduction in maximum temperatures was observed when substrate and component to fluid thermal conductivity ratios were increased beyond 10 and 25, respectively. Component to substrate width ratio change from .25 to .999 resulted in approximately linear decrease in the maximum temperature. A companion experimental study of three- dimensional natural convection transport from a flush mounted array of heat sources in water was also conducted. Computer temperatures compared favorably to appropriate experimental data.


Subjects: Heat,Transmission; Fluid mechanics.; Electronic Cooling; Liquid Immersion; Natural Convection; Numerical Heat Transfer
Language English
Publication date June 1990
publication_date QS:P577,+1990-06-00T00:00:00Z/10
Current location
IA Collections: navalpostgraduateschoollibrary; fedlink
Accession number
acomputationalnd1094530645
Source
Internet Archive identifier: acomputationalnd1094530645
https://archive.org/download/acomputationalnd1094530645/acomputationalnd1094530645.pdf
Permission
(Reusing this file)
This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. As such, it is in the public domain, and under the provisions of Title 17, United States Code, Section 105, may not be copyrighted.

Licensing[edit]

Public domain
This work is in the public domain in the United States because it is a work prepared by an officer or employee of the United States Government as part of that person’s official duties under the terms of Title 17, Chapter 1, Section 105 of the US Code. Note: This only applies to original works of the Federal Government and not to the work of any individual U.S. state, territory, commonwealth, county, municipality, or any other subdivision. This template also does not apply to postage stamp designs published by the United States Postal Service since 1978. (See § 313.6(C)(1) of Compendium of U.S. Copyright Office Practices). It also does not apply to certain US coins; see The US Mint Terms of Use.

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Date/TimeThumbnailDimensionsUserComment
current06:50, 8 July 2020Thumbnail for version as of 06:50, 8 July 20201,275 × 1,650, 146 pages (4.55 MB) (talk | contribs)FEDLINK - United States Federal Collection acomputationalnd1094530645 (User talk:Fæ/IA books#Fork8) (batch 1990-1992 #2810)

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