File:A COMSOL SIMULATION OF MICROSPHERE-BASED PASSIVE MATERIAL FOR LOW TEMPERATURE DIVING SUITS (IA acomsolsimulatio1094560445).pdf

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A COMSOL SIMULATION OF MICROSPHERE-BASED PASSIVE MATERIAL FOR LOW TEMPERATURE DIVING SUITS   (Wikidata search (Cirrus search) Wikidata query (SPARQL)  Create new Wikidata item based on this file)
Author
Oldenkamp, John A.
image of artwork listed in title parameter on this page
Title
A COMSOL SIMULATION OF MICROSPHERE-BASED PASSIVE MATERIAL FOR LOW TEMPERATURE DIVING SUITS
Publisher
Monterey, CA; Naval Postgraduate School
Description

The United States Navy conducts diving operations in various places and climates all over the world. The neoprene wet suit protects the diver from cold water temperatures, extending the duration the diver can stay in the water. Neoprene is a soft material made of air-foamed rubber that uses small, flexible air pockets to thermally insulate a diver from the cold. However, as the diver descends, increased ambient pressure compresses the neoprene, decreasing its thickness and shrinking its air pockets. As a result, the suit’s insulation capability significantly degrades with depth, adversely affecting diver operations and persistence time at depth. One potential solution is the use of rigid glass microspheres as the thermally insulating material, which should be impervious to pressure changes associated with diving depth. This thesis develops a model using COMSOL Multiphysics software that can be used to theoretically verify previous work and provide the framework for computer simulations to predict the thermal resistivity of various materials as a function of microsphere composition, steric distribution, and volumetric fraction within the carrier polymer.


Subjects: diver; insulation; thermal; composite; material; microspheres; silicone; protection; divesuit; diving; safety; hypothermia
Language English
Publication date September 2018
Current location
IA Collections: navalpostgraduateschoollibrary; fedlink
Accession number
acomsolsimulatio1094560445
Source
Internet Archive identifier: acomsolsimulatio1094560445
https://archive.org/download/acomsolsimulatio1094560445/acomsolsimulatio1094560445.pdf
Permission
(Reusing this file)
This publication is a work of the U.S. Government as defined in Title 17, United States Code, Section 101. Copyright protection is not available for this work in the United States.

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Public domain
This work is in the public domain in the United States because it is a work prepared by an officer or employee of the United States Government as part of that person’s official duties under the terms of Title 17, Chapter 1, Section 105 of the US Code. Note: This only applies to original works of the Federal Government and not to the work of any individual U.S. state, territory, commonwealth, county, municipality, or any other subdivision. This template also does not apply to postage stamp designs published by the United States Postal Service since 1978. (See § 313.6(C)(1) of Compendium of U.S. Copyright Office Practices). It also does not apply to certain US coins; see The US Mint Terms of Use.

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Date/TimeThumbnailDimensionsUserComment
current22:05, 13 July 2020Thumbnail for version as of 22:05, 13 July 20201,275 × 1,650, 72 pages (1.26 MB) (talk | contribs)FEDLINK - United States Federal Collection acomsolsimulatio1094560445 (User talk:Fæ/IA books#Fork8) (batch 1993-2020 #5277)

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