Category:PoP integrated circuit packages

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English: Package on package (PoP) is an integrated circuit packaging method to combine vertically discrete logic and memory ball grid array (BGA) packages.
<nowiki>Package on Package; package on package; Package-on-package; Package on package; Package-on-Package; 패키지 온 패키지; package on a package; بسته روی یک بسته; 層疊式封裝; محيفظة على مُحيفظة; integrated circuit packaging method; روش بسته‌بندی مدار مجتمع; Technik der Mikroelektronik; fabricagetechniek in de micro-elektronica; PoP; Package on Package; PoP; package on package; پی‌او‌پی; بسته روی بسته; PoP</nowiki>
package on a package 
integrated circuit packaging method
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Media in category "PoP integrated circuit packages"

The following 3 files are in this category, out of 3 total.

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