File:SuperConformalCu.png

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Original file(1,090 × 616 pixels, file size: 25 KB, MIME type: image/png)

Captions

Captions

log(N+1) number of patent families (worldwide) and non-patent publications per year about superconformal copper electrodeposition

Summary[edit]

Description
English: Patent search was done on 2023-02-15 with Questel-Orbit database using search string : ((CU OR COPPER) S (ELECTROPLAT+ OR ELECTRODEPOSIT+ OR FILLING ) S (BOTTOM_UP OR SUPER_CONFORMAL OR DAMASCENE OR INTER_CONNECT OR INTER_CONNECTS OR MICROVIA OR MICROVIAS OR SUB_MICRON OR NANOMETER))/TI/AB/OBJ/ADB/ICLM/CLMS/TX AND semiconductors/TECD. Non-patent searches were done on the same day with Web of Science, SciFinder-N, and lens.org .
Date
Source Own work
Author Walter Tau

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Date/TimeThumbnailDimensionsUserComment
current23:13, 14 February 2023Thumbnail for version as of 23:13, 14 February 20231,090 × 616 (25 KB)Walter Tau (talk | contribs)Uploaded own work with UploadWizard

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