File:Cut Redistribution.png

English: Cut redistribution for spacer patterning reduces the number of required cut masks to one. The target lines are first extended to much longer lengths to enable spacer patterning. Then the preliminary cut (red) assignments are made to separate the dummy sections (yellow) from the real interconnect. Finally, the cuts are redistributed, sometimes by extending interconnect lines by some amount (green), as well as by adding cuts (purple) to dummy lines as needed. The cut areas can be larger to reduce unwanted capacitance, including the support of SID SADP. Refs.: (Cut redistribution) Y. Zhang et al., ASP-DAC 2017, p. 360 (2017); (Reduced capacitance) W. Gillijns et al., Proc. SPIE 9427, 942709 (2015); SID SADP: US patent 8312394.