File:Simon 3.png

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English: De acuerdo al trabajo realizado por Jay Brusse y Lyudmyla Panashchenko, A Screening Method Using Pulsed-Power Combined with Infrared Imaging to Detect Pattern Defects in Bulk Metal Foil or Thin Film Resistors, al final del proceso de la fabricación de las resistencias de lámina metalica, es representado en el siguiente dibujo, observar que la capa de cobre no existe.
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Author Donxsegundo

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Date/TimeThumbnailDimensionsUserComment
current13:45, 19 December 2022Thumbnail for version as of 13:45, 19 December 2022920 × 850 (59 KB)Donxsegundo (talk | contribs)Uploaded own work with UploadWizard

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