File:Heat Sinks (5830471641).jpg
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| Description |
That’s hot. The 470 V/6 was Amdahl's first product after breaking away from IBM. It was faster and cheaper than the IBM System/370, and the big iron competition had begun. This 1975 bipolar ECL design used a novel radiator package that allowed the chips to be air cooled, a big advance over the liquid plumbing used by others. Six years later, IBM took the heat sink concept to the extreme in a helium infused <a href="https://www.flickr.com/photos/jurvetson/3648247047/comment72157620176143423">multi-chip module</a>. When I did my first chip designs at HP in 1987-89 they were also bipolar ECL. 1GHz fT if I recall. I designed a QPSK modulator and some unusual amps. I wish I still had the circuit diagrams, as I spent a bit of artistic effort on a Devo plant pot hat rendered in iridescent SiO2 thin films. |
| Date | |
| Source | Heat Sinks |
| Author | Steve Jurvetson from Menlo Park, USA |
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This file is licensed under the Creative Commons Attribution 2.0 Generic license.
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This image was originally posted to Flickr by jurvetson at https://flickr.com/photos/44124348109@N01/5830471641 (archive). It was reviewed on 28 July 2019 by FlickreviewR 2 and was confirmed to be licensed under the terms of the cc-by-2.0. |
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| Date/Time | Thumbnail | Dimensions | User | Comment | |
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| current | 20:02, 28 July 2019 | | 4,458 × 3,540 (5.11 MB) | Meisam (talk | contribs) | Transferred from Flickr via #flickr2commons |
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