File:Cudeposition.gif

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Cudeposition.gif ‎(320 × 380 pixels, file size: 669 KB, MIME type: image/gif, looped, 187 frames, 19 s)

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Description

Molecular dynamics computer simulation of the deposition of a single copper atom with

a kinetic energy of 1 eV on a copper surface. Technical details: cross section of two atom layers in the middle of a larger (10x10x10 unit cells) 3D simulation cell. Simulation made with Sabochick-Lam embedded-atom method potential, Berendsen temperature control used only at the outer boundaries to scale temperature down to 0 K. Initial temperature 0 K (cell prerelaxed to allow for surface relaxation inwards). This kind of processes occur in reality during physical vapour deposition.
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Author Knordlun

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Public domain This work has been released into the public domain by its author, I, Knordlun. This applies worldwide.
In some countries this may not be legally possible; if so:
I, Knordlun grants anyone the right to use this work for any purpose, without any conditions, unless such conditions are required by law.

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Date/TimeThumbnailDimensionsUserComment
current12:39, 30 July 2007Thumbnail for version as of 12:39, 30 July 2007320 × 380 (669 KB)Knordlun (talk | contribs){{Information |Description=Molecular dynamics computer simulation of the deposition of a single copper atom on a copper surface. Technical details: cross section of two atom layers in the middle of a larger 3D simulation cell. Simulation made with Sabochi

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