File:BGA - Querschnitt.svg
Jump to navigation
Jump to search
Size of this PNG preview of this SVG file: 728 × 390 pixels. Other resolutions: 320 × 171 pixels | 640 × 343 pixels | 1,024 × 549 pixels | 1,280 × 686 pixels | 2,560 × 1,371 pixels.
Original file (SVG file, nominally 728 × 390 pixels, file size: 49 KB)
Captions
Captions
Add a one-line explanation of what this file represents
Summary
[edit]| Description |
English: BGA with a interposer between the integrated circuit die to ball grid array.
German labeling
Deutsch: Kontaktierungsschema
Deutsche Beschriftung |
| Date | |
| Source | Own work based on: BGA package sideview.PNG |
| Author |
Vector: |
| SVG development |
Licensing
[edit]
I, the copyright holder of this work, hereby publish it under the following licenses:
|
Permission is granted to copy, distribute and/or modify this document under the terms of the GNU Free Documentation License, Version 1.2 or any later version published by the Free Software Foundation; with no Invariant Sections, no Front-Cover Texts, and no Back-Cover Texts. A copy of the license is included in the section entitled GNU Free Documentation License. |
This file is licensed under the Creative Commons Attribution-Share Alike 3.0 Unported, 2.5 Generic, 2.0 Generic and 1.0 Generic license.
- You are free:
- to share – to copy, distribute and transmit the work
- to remix – to adapt the work
- Under the following conditions:
- attribution – You must give appropriate credit, provide a link to the license, and indicate if changes were made. You may do so in any reasonable manner, but not in any way that suggests the licensor endorses you or your use.
- share alike – If you remix, transform, or build upon the material, you must distribute your contributions under the same or compatible license as the original.
You may select the license of your choice.
File history
Click on a date/time to view the file as it appeared at that time.
| Date/Time | Thumbnail | Dimensions | User | Comment | |
|---|---|---|---|---|---|
| current | 05:15, 20 January 2011 | | 728 × 390 (49 KB) | Serenthia (talk | contribs) | ....and the text actually converted to paths, rather than me just thinking I'd done it. |
| 05:14, 20 January 2011 |  | 728 × 390 (29 KB) | Serenthia (talk | contribs) | Updated to match BGA Package Sideview.svg and LGA Package Sideview.svg. | |
| 12:12, 20 December 2010 |  | 819 × 450 (40 KB) | Trex2001 (talk | contribs) | typo | |
| 12:57, 16 December 2010 |  | 819 × 450 (40 KB) | Trex2001 (talk | contribs) | damn Inkscape | |
| 12:56, 16 December 2010 |  | 819 × 450 (48 KB) | Trex2001 (talk | contribs) | another try | |
| 12:52, 16 December 2010 |  | 1,052 × 744 (53 KB) | Trex2001 (talk | contribs) | converted text to paths | |
| 12:50, 16 December 2010 |  | 1,052 × 744 (18 KB) | Trex2001 (talk | contribs) | resaved from Inkscape | |
| 12:46, 16 December 2010 |  | 1,052 × 744 (18 KB) | Trex2001 (talk | contribs) | {{Information |Description={{en|1=BGA with a interposer between the integrated circuit die to ball grid array. German labeling}} {{de|1=Kontaktierungsschema Deutsche Beschriftung}} |Source={{own}} |Author=Trex2001 |Date=2010-12-16 |Permi |
You cannot overwrite this file.
File usage on Commons
There are no pages that use this file.
File usage on other wikis
The following other wikis use this file:
- Usage on de.wikipedia.org
